Integrated Circuit Package Development & Process Engineer III
Location: Colorado Springs
Posted on: November 11, 2018
Job Ad Template Summary Cobham Semiconductor Space Solution (SCSS) is seeking anIntegrated Circuit Package Development & Process Engineer tosupport with manufacturing process development, packagedevelopment and process improvement efforts related to our currentand existing manufacturing projects. Essential Duties and Responsibilities: Develop and/or improve Integrated Circuit (IC) relatedassembly processes and packages for products.Work with customers to understand and define the productrequirements.Select appropriate material sets, conduct experiments anddevelop manufacturing processes to meet quality and reliabilitytargets for the product.Develop assembly and/or manufacturing processes using existingequipment and/or recommend equipment suitable for manufacturingor recommend appropriate outsource manufacturing to meetmanufacturing requirements and capacity limitations.Document process details, procedures, procurement, trainingand R&M specifications.Perform cost effective continuous process efforts to improvequality and reliability of products.Other Duties and Responsibilities: Provide technical inputs to Product Development Teams.Utilize CAD design tools to perform Thermal and Mechanicalmodeling, design fixtures and hardware, track progress andpublish reports as part of this job function.Interface with external customers as needed.Maintain a thorough understanding of manufacturing equipmentin order to support the development of cost effective andefficient manufacturing processes.Conduct and/or support Failure Analysis efforts to determineroot cause and implement effective corrective action to addressmanufacturing issues.Work with vendors as needed for procurement activities.Knowledge, Skills, Abilities and Education ExperienceRequirements: A Bachelor's Degree in Mechanical Engineering or MaterialSciences from a four year college or university and a minimum oftwo years of related experience and/or training is required.Understanding of package design, modeling, IC and assemblyprocesses.Budgeting and Fiscal Requirements: Generate documentation needed in support of justifications forcapital equipment purchases.Computer Skills: Proficient in the full suite of Microsoft Office--- products -Excel, Word, Visio, Power Point, Project. Knowledgeof CAD or similar system a plus. Ability to use microelectronic package electrical modeling andsimulation software, CAD tools (SolidWorks, Pro-E, Auto CAD orMicroStation, ICEMAX) and Cadence APD.Security: All applicants must be a U.S Citizen or U.S Person as defined byITAR (a lawful permanent resident or someone who is a protectedindividual as defined by 8 U.S.C.1324b(a)(3)). In order to beeligible for positions requiring a Security Clearance, you must be aUS Citizen. About Us: Cobham is one of the world's leading companies engaged in thedevelopment, delivery and support of leading-edge aerospace anddefense systems in the air, on land and at sea. Our clients andpartners trust Cobham to deliver the mission-critical technologythey need, and we trust our employees to draw on their ingenuity andpassion to deliver those solutions. This leads to an empoweringculture for our people. Our Leadership team is open, sharing plansfor the next five years, driving retention by offering demanding,exciting work, and providing full guidance and mentoring. Cobham is an Equal Opportunity/Affirmative Action Employer andembraces diversity in our employee population. It is the policy ofCobham to provide equal opportunity to all qualified applicants andemployees without regard to race, color, religion, sex, sexualorientation, gender identity, national origin, age, disability,protected veteran status, or genetic information. Cobham willrefrain from discharging, or otherwise discriminating against,employees or applicants who inquire about, discuss, or disclosetheir compensation or the compensation of other employees orapplicants. PandoLogic.Category: Manufacturing, Keywords: Process Engineer
Keywords: Cobham, Colorado Springs , Integrated Circuit Package Development & Process Engineer III, Engineering , Colorado Springs, Colorado
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