Die Attach (Process) Engineer
Company: Samtec
Location: Colorado Springs
Posted on: March 9, 2023
Job Description:
Founded in 1976, Samtec is a privately held, $1 Billion global
manufacturer of a -broad line of electronic interconnect solutions,
including High-Speed Board-to-Board, -High-Speed Cables, Mid-Board
and Panel Optics, Precision RF, Flexible Stacking, and
-Micro/Rugged components and cables. Samtec Technology Centers are
dedicated to -developing and advancing technologies, strategies and
products to optimize both the -performance and cost of a system
from the bare die to an interface 100 meters away, -and all
interconnect points in between. With 40+ international locations
and products -sold in more than 125 different countries, Samtec's
global presence enables its -unmatched customer service.
The salary range for this position is $77,000 - $102,000 per year
inclusive of applicable bonus and commensurate with experience.
Standard benefit offerings available are medical (HSA/PPO), dental,
vision, group life, AD&D, short and long term disability, EAP,
401k plus other voluntary options as well as time off. -
Summary/Objective: - The Process Engineer will perform IC packaging
process development and improvement directly resulting in increased
efficiency and quality on the production floor. This will be
achieved through start up and qualification of new equipment,
design of experiments to support customer requirements and internal
development projects, documentation and training.
Essential Functions/Responsibilities:
- Assembly Engineering support to review Customer requirements
and determine the correct process, materials and time frame needed
to meet those requirements.
- Interaction as required with customers regarding technical
issues and specification reviews.
- Manage and define Assembly Processes relating to specific
products or customers.
- Responsible for conducting thorough Design of Experiments on
new IC Assembly Processes with the goal of developing new process
technology and improving productivity.
- Collect and analyze equipment and process performance data to
ensure high quality output.
- Generate detailed reports and specifications documenting all
experimental and process findings and procedures. Provide DOE, SPC,
and yield reporting in a clear and presentable format.
- Assess existing processes and identify areas of improvement for
these systems.
- Evaluate and provide recommendations on new equipment to
support continuous technology improvements to meet future customer
requirements.
- Conduct root cause analysis and corrective actions related to
process failures.
- Identify and implement cost, quality, and yield
improvements.
- Supervisory responsibility for technicians may be required.
"The responsibilities as defined are intended to serve as a general
guideline for this position. Associates may be asked to perform
additional tasks depending on strengths and capabilities." Required
Experience:
- 5+ years of Assembly Process Engineering experience. Die Attach
or Pick-and-Place experience & processes is desired.
- Basic understanding of semiconductor process. Hands-on
experience in Semiconductor Back-End Process Engineering
preferred.
- Experience in Statistical Process Control, Design of
Experiments & FMEA required.
- Experience in microelectronic package design and SolidWorks,
AutoCAD, or other engineering design, modeling or simulation
software is desirable.
- Detail oriented, data entry accuracy, problem solver, good
analytical skills, team player, multitask capability.
- General computer skills, including Microsoft Office Suite.
- Strong written and verbal communication skills.
- Must be a self-starter with strong leadership skills.
- Excellent communication skills and demonstrated problem solving
ability.
- Six Sigma and Lean Manufacturing training and experience.
- Excellent interpersonal skills in relating to both internal and
external customers.
- Ability to meet International Traffic in Arms Regulations
(ITAR) compliance requirements.
- Lifting Requirements: Light Work - must be able to lift up to
20 pounds regularly from floor to waist.
- Must be able to sit for more than 90 consecutive minutes, and
not suffer from any sensory deprivation and/or paralysis of the
limbs.
- Must be able to spend extended periods standing and walking in
a clean-room environment.
- Hazards and Atmospheric Conditions: Must be willing to work in
a chemical environment while following all department safety rules
and regulations.
- Some travel may be required. Preferred Education:
- Bachelor's Degree in Engineering (Electrical, Mechanical,
Chemical, Material Science) or equivalent is required.
Keywords: Samtec, Colorado Springs , Die Attach (Process) Engineer, Engineering , Colorado Springs, Colorado
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